Micro-nano foundry is developed with the development of MEMS, and MEMS is developed with the micromachining of semiconductor integrated circuits. At present, micro-nano foundry is mainly used in microfluidic chips and other fields to integrate chips in the technical process of biochemical laboratories. The MEMS involved in micro-nano foundry mainly includes micro-mechanisms, micro-sensors, micro-a

Packaging in micro-nano foundry is the most critical and expensive step. Many semiconductor companies have their own research and opinions on packaging. In foreign countries, STMicroelectronics uses a low-cost packaging method, which is one of the characteristics of its production of inertial sensors. At the same time, through mass production, lower costs can be obtained. The packaging method they

Chip packaging is also a part of micro-nano foundry, and many MEMS product vendors will use packaging as a reference for product differentiation and market competition. Moreover, in the design of MEMS devices, packaging methods are all parts of the design process that must be considered. Since packaging costs account for 20%-40% of all costs, this step is even more important. The choice of packagi