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  • Lithography

    Lithography

    Lithography is an important step in the semiconductor device manufacturing process, using exposure and development on the photoresist layer to depict the structure of the device, a......

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  • Coating Process

    Coating Process

    Vacuum coating is the deposition of a metal or non-metal in the form of a vapor phase onto the surface of a material in a vacuum environment to form a dense thin film. The quality ......

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  • Etching

    Etching

    Etching (Etch) is the technique of selective etching of a semiconductor substrate surface or surface coverage film according to a mask pattern or design requirement, and is a fairl......

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  • Bonding

    Bonding

    Bonding is a technique in which two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces are directly bonded under certain conditions by van de......

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  • PI

    PI

    Polyimide (PI) is produced by polycondensation and cast film formation of homothallic dianhydride (PMDA) and diamino diphenyl ether (DDE) in a strong polar solvent, followed by imi......

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  • PDMS

    PDMS

    PDMS (polydimethylsiloxane) is kind of widely used polymer material in microfluidics and other fields which is easy to process with good chemical inertness, good optical permeabili......

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  • TSV

    TSV

    TSV technology (through-silicon via technology), commonly referred to as silicon via technology, is a new technical solution for interconnecting stacked chips in 3D integrated circ......

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  • Lithography mask

    Lithography mask

    Photolithography mask lithography, or mask lithography for short, is a graphic master used by the lithography process commonly used in micro-nano processing technology. The opaque ......

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  • Other

    Other

    YW MEMS provide a full set of MEMS process, including cutting, wafer cleaning, packaging, testing and other commissioned services. We hold the mission of Better chip, better world,......

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  • A moment in history! Suzhou in-situ listed on the New Fourth Board

    On January 18, 2017, the corporate listing ceremony of Suzhou Equity Exchange Center was grandly held at the Dongsha Lake Equity Investment Center in the park. YW MEMS (enterprise code: 900107) successfully became the listed company. Premier Li Keqiang of the State Council presided over an executive meeting of the State Council on January 11 to determine policies and measures to standardize the de

  • YW MEMS completes PreA-1 round of multi-million yuan financing

    On March 23, YW MEMS, an industry-leading independent research and development start-up company for bio-microelectromechanical (MEMS) chips, announced the completion of an angel round of financing of millions of yuan, invested by well-known domestic angel investors. After the completion of this round of financing, In-Situ Chips will focus on the emerging bio-MEMS chip market

  • Congratulations to the YW MEMS for completing the tens of millions of Pre-A round of financing

    YW MEMS (hereinafter referred to as YW MEMS) completed in November a tens of millions of Pre-A rounds of financing led by Zhiyou Jinmiao Fund, Kaifeng Venture Capital, and Dexun Investment. This round of financing is mainly used for the construction of pilot and mass production test plants for MEMS liquid flow sensors.The in-situ chip was established in 2015. In 2018, it received an angel round of

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