Polyimide (PI) is produced by polycondensation and cast film formation of homothallic dianhydride (PMDA) and diamino diphenyl ether (DDE) in a strong polar solvent, followed by imidization. Polyimide has excellent resistance to high and low temperatures, electrical insulation, adhesion, dielectric resistance, mechanical and radiation resistance, can be used in the -269 ℃ - 280 ℃ temperature range for a long time, a short time can reach 400 ℃ high temperature. YW MEMS master PI dry film and PI adhesive two types of device processing technology, to provide customers with high-quality technical services.

As a special engineering material, polyimide is widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation film, laser and other fields.

Dry film: thickness 20-200um, etching depth ≤ 15um

Non-photosensitive solution: etching depth 0-21um