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Leading by the team with more than 10 years of MEMS process experience

  • Process introduction

    YW MEMS provide a full set of MEMS process, including cutting, wafer cleaning, packaging, testing and other commissioned services. We hold the mission of "Better chip, better world", to provide good scientific research services for universities and research institutions, enterprises, supporting research and development.

  • Process capability

    Wafer/wafer cutting: 2 inch, 4 inch, 6 inch, 8 inch

    Wafer/wafer drilling: micrometer size

    Silicon cleaning: organic cleaning, inorganic cleaning

    Test: electrical test, optical test

  • Wire bonding

    Solder joint size: 30um

    PAD spacing: 100um

    Gold wire diameter: 10~50um

  • Four advantages of YW MEMS

    Professionally provide chip design and research and development for enterprises

  • Full range of fabrication

    Full range of fabrication with good quality

  • Full Process Monitoring

    1-to-1 foundry Service Checking all levels for clients

  • Efficient and fast

    24-hour response Delivered as planned

  • Strict confidentiality

    Confidentiality agreements fabrication safety and security

  • They've always chosen YW MEMS

    Serving major universities and research institutes across the country to help scientific research

    Cooperation Process
  • Online consultation

  • Project evaluation

  • Contract signing

  • Project implementation

  • Project delivery

  • After-sales service

  • Copyrights YW MEMS © ICP 15018093-6  Su Gong An Bei NO.32059002002439   sitemap

  • Call us

    业务咨询 小原

    13706139363

  • Message