TSV technology (through-silicon via technology), commonly referred to as silicon via technology, is a new technical solution for interconnecting stacked chips in 3D integrated circuits, enabling the highest density of stacked chips in the 3D direction, the shortest interconnect lines between chips, the smallest form factor, and greatly improving chip speed and low-power performance. YW MEMS are equipped with the latest TSV technology and can meet customer individual TSV requirements.

As one of the most promising technologies in microelectronics manufacturing, TSV technology is already widely used in MEMS devices, memories, image sensors, power amplifiers, bio-applications and various mobile phone chips.

Opening size: 20-30um

Depth to width ratio: 5:1

Electroplating material: Cu、Sn

Through hole status:  hollow hole