Engineer Fan
Engineer Sun
Leading by the team with more than 10 years of MEMS process experience
Bonding is a technique in which two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces are directly bonded under certain conditions by van der Waals, molecular, or even atomic forces to form a wafer. Bonding is one of the most important steps in the MEMS process. Choosing the best bonding process can ensure the mechanical stability, hermeticity and functional satisfaction of the device. YW MEMS have mastered a variety of bonding technologies, which are mature enough to meet the requirements of different substrates, thicknesses, temperatures and pressures of various customers. |
Bonding technology is widely used in the production of microelectronic devices such as microcavity devices, cantilever beam devices, sacrificial layers, and special structures. |
Anode bonding Eutectic bonding (AuSn, CuSn, AuSi, etc.) Glue bonding (AZ4620, SU8, special adhesive for bonding) Lead Wire Bonding multi-layered bonding Silicon & Silicon Bonding Inverted Keying |
Professionally provide chip design and research and development for enterprises
Full range of fabrication with good quality
1-to-1 foundry Service Checking all levels for clients
24-hour response Delivered as planned
Confidentiality agreements fabrication safety and security
Serving major universities and research institutes across the country to help scientific research
Online consultation
Project evaluation
Contract signing
Project implementation
Project delivery
After-sales service
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