Bonding is a technique in which two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces are directly bonded under certain conditions by van der Waals, molecular, or even atomic forces to form a wafer. Bonding is one of the most important steps in the MEMS process. Choosing the best bonding process can ensure the mechanical stability, hermeticity and functional satisfaction of the device. YW MEMS have mastered a variety of bonding technologies, which are mature enough to meet the requirements of different substrates, thicknesses, temperatures and pressures of various customers.

Bonding technology is widely used in the production of microelectronic devices such as microcavity devices, cantilever beam devices, sacrificial layers, and special structures.

Anode bonding

Eutectic bonding (AuSn, CuSn, AuSi, etc.)

Glue bonding (AZ4620, SU8, special adhesive for bonding)

Lead Wire Bonding

multi-layered bonding

Silicon & Silicon Bonding

Inverted Keying